Conductor Pastes for Alumina, other Electronic Grade Substrates and Materials for all forms of Sensors..


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Interconnect Materials

GEM Ltd. can custom make any of the common conductor materials used in interconnection circuitry, to terminate electronic components, to form the electrode on a sensor device or to form an electrode on an inert material that will subsequently have a sensor matrix built upon it. Common conductors include.

As well as the above conductors we can offer the full range of dielectric materials to suit the above. Custom formulated resistors are available to customer specifications.

The most common application method for these materials is screen-printing but other application techniques can be specified.

The most usual substrate material that is specified is that of Alumina, however, we have formulated products for all the most commonly used substrates or sensor materials. These include Stainless Steel and the newer ceramic materials. Furthermore we have formulated products for the new high technology substrates that are coming on to the market. These include; Aluminium Nitride and metal matrix compounds.

GEM Ltd. can now develop and manufacture a full range of base metal conductors from air firing Aluminium materials to the normal inert atmosphere firing copper and nickel systems. For our latest information please contact us.

GEM are developing a new range of Low Fire Materials. Using new advanced technology we have managed to reduce the firing temperature of metallic based pastes from a normal of 400 to 450°C to the range of 150 to 350°C. This new revolutionary type of system means that it is now additionally possible to fire onto polymeric rather than ceramic materials. Additionally these new materials with their extremely low firing temperature may be used to provide contact to: or circuits upon Aluminium metal.

Please contact us with your exact requirements.

Products for Low Temperature Co-Firing Ceramic Tape. ( LTCC )

Gem can offer a range of co-firing conductors, via fills and top layer conductors for LTCC systems.

Typical of these are Platinum Ink's and Silver Palladium Ink.

Contact us with your processing & application details and we will select a product for you.

For Additional information see our latest data

 

BASE METAL SYSTEMS

Contact us with your processing & application details and we will select a product for you.


Sensor Systems

For sensor based products we formulate our systems individually to suit the required properties of the finished sensor along with the firing/curing schedule and the application method that is prescribed for the device. The range of materials for sensor materials is large, our materials can be used as the sensor contact or as part of the sensor itself, the range that we have covered includes:-

Listed below are examples of common metal systems that we manufacture pastes from, however, others can be formulated by consultation:-

PRECIOUS METAL SYSTEMS for Biosensors

For Gold working electrodes we would recommend a newley developed material (see link )
For Silver working electrodes (see link )
For Platinum (see link )

For Additional information see our latest data

 

For other sensors on Ceramic Substrates

The following range of electrodes and contact materials can be formulated for the full range of sensor products. Please contact us for specific information


Products for Fuel Cells.

GEM has worked with a number of companies and research facilities on the development of the electrode materials, contact and output tracks, sealing materials etc. that are needed.

We have made high temperature stable materials (S.O.F.C), materials for low temperature cells, electrode materials of Pt, Pd, Pd/Ni, Ni,Ni Oxide, Lanthanum Compounds, Glass sealing compounds etc.

These have been produced for screen printing and dipping applications

Typical of these pastes are pure Platinum paste and aNickel paste.

As this area is highly specialized please contactus with your processing & application details and we will select a product for you.

For Additional information see our latest data

 


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© Gwent Electronic Materials Ltd 2008
These pages were last updated on 25th April 2008
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