Termination Materials.

PZT Devices

Termination materials for single and multilayer structures are formulated for application by dipping, spraying or screen printing.

These materials are especially compounded to resist migration after poling. Systems are also available for mechanical contact use or contacting by soldering. The normal pastes are designed to fire in the region of 600°C to 900°C. A typical example are found in our latest data. A higher solids version of this material is alos in our latest data

Pastes are available to fire at lower temperatures to suit the newer ceramic materials also metallo-organic systems have been used to give thin layers on other Ferro-electric components.
Pastes have been formulated for low temperature composite systems these are used both as temporary and permanent electrodes.
For Additional information see our latest data

Varistors

Precious metal or base metal pastes can be formulated to suit the specific requirements of the varistor manufacturer. The materials are custom designed to suit the individual varistor oxide mixture the adhesion mechanism is then adjusted accordingly.

These can be provided in a number of different application media.

For Additional information see our latest data

PTC Thermistors

Paste systems containing Aluminium.

These inks fire in air over the range of 600°C to 950°C. They are of high conductivity and can be contacted onto by silver loaded adhesives, fired silver films or mechanical contact. A typical example is Aluminium Paste

Pastes containing Silver.

These materials are especially formulated with additives to give stable electronic response. The systems are normally two parts, a contacting layer and a connection layer. The second layer may be produced in a solderable form if required. A typical two part system isa base layer and a top coat.
Also one part systems are availible in our latest data section

Pastes and adhesives for bonding the PTC device to the external circuitry or mounting system are available.

Pastes are also available to contact onto PTC devices that have been initially coated by other techniques i.e. sputtering..

For Additional information see our latest data

NTC Thermistors

Termination Inks are formulated for ceramic based NTC Thermistors.

These can be compounded for dipping/spraying or screen printing applications. By selection of the adhesion agents various firing temperatures can be obtained.

Base metal inks that are air fireable are currently under investigation.
New high temperature termination systems for NTC's designed to operate over 1000°C

Silver based system

For Additional information see our latest data

Ceramic Capacitors

Silver containing pastes are formulated for ceramic capacitors where soldering is a requirement.

Variations are also available to cover those applications which require a minimal coating of silver paste which after firing on is electroplated to give the solderable contact.

Alternatively base metal formulations are available where mechanical contact or over-printing with Silver is required. Typical examples are found in our latest data section

For Additional information see our latest data

Tantalum Capacitors

Our range of materials for Tantalum capacitors covers the whole materials requirement of the Tantalum capacitor manufacturer.

These include:

Manganese dioxide dipping systems. (Contact for information)
Carbon or graphite based inks to make the initial contact onto the tantalum electrode, normally this is a dipping system, but other variations can be manufactured.
Silver or Silver/base metal electrode dipping systems. A typical Silver system are availible
Silver adhesive materials for chip Tantalum applications. These systems are designed to adhere the chip tantalum device to the lead frame and resist the subsequent moulding procedures.
For Additional information see our latest data

Contact us for our other Tantalum Capacitor Products.

Tubular Capacitors

Dipping or spraying formulations can be formulated for tubular capacitors.

These materials are usually Silver containing and are solderable. However, if other metal systems are required these can be easily incorporated.

Variations are also available to cover those applications which require a minimal coating of silver paste which after firing on is electroplated to give the solderable

For Additional information see our latest data

contact. (Contact us for information)

Back to Products Page

[Home]